High-Speed Solder Bump Inspection System Using a Laser Scanner and CCD Camera

摘要

We have developed technologies which inspect the shape of solder bumps. The bumps are used to solder an LSI to a printed wiring board in high-speed workstations. The inspection system developed can measure the height, di- ameter, and brightness of bumps at very high speed. The bump height is measured using triangulation, in which a laser beam scans the bumps, and reflected light is detected with a position sensitive detector(PSD). The diameter and the brightness are measured using a microscope and a CCD camera.