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首页> 外文期刊>IEEE transactions on very large scale integration (VLSI) systems >On-chip decoupling capacitor optimization using architectural level prediction
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On-chip decoupling capacitor optimization using architectural level prediction

机译:使用架构级预测的片上去耦电容器优化

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摘要

Switching activity-generated power-supply grid-noise presents a major obstacle to the reduction of supply voltage in future generation semiconductor technologies. A popular technique to counter this issue involves the usage of decoupling capacitors. This paper presents a novel design technique for sizing and placing on-chip decoupling capacitors based on activity signatures from the microarchitecture. Simulation of a typical processor workload (SPEC95) provides a realistic stimulation of microarchitecture elements that is coupled with a spatial power grid model. Evaluation of the proposed technique on typical microprocessor implementations (the Alpha 21264 and the Pentium II) indicates that this technique can produce up to a 30% improvement in maximum noise levels over a uniform decoupling capacitor placement strategy.
机译:开关活动产生的电源电网噪声是下一代半导体技术中降低电源电压的主要障碍。解决此问题的一种流行技术是使用去耦电容器。本文提出了一种新颖的设计技术,该技术可根据微体系结构的活动签名确定尺寸并放置片上去耦电容器。典型处理器工作负载(SPEC95)的仿真提供了微体系结构元素的逼真刺激,并与空间电网模型相结合。对建议的技术在典型的微处理器实现(Alpha 21264和Pentium II)上的评估表明,与统一的去耦电容器放置策略相比,该技术可以将最大噪声水平提高30%。

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