首页> 外国专利> EDRAM/DRAM fabricated capacitors for use in on-chip PMUS and as decoupling capacitors in an integrated EDRAM/DRAM and PMU system

EDRAM/DRAM fabricated capacitors for use in on-chip PMUS and as decoupling capacitors in an integrated EDRAM/DRAM and PMU system

机译:EDRAM / DRAM制成的电容器,用于片上PMUS以及集成EDRAM / DRAM和PMU系统中的去耦电容器

摘要

One or more integrated circuits including at least one integrated circuit that is fabricated in a DRAM fabrication process. Capacitors in the DRAM-fabricated integrated circuit can be used for decoupling for logic components of the integrated circuits, and may be used for fine-grain on-chip PMUs. The capacitors may be physically placed near the logic components for which the capacitors are providing decoupling capacitance, in an embodiment. The capacitors may be series connections of at least two capacitors, or at least one capacitor and a switch, to provide decoupling capacitance in the face of defects, in an embodiment. Embedded DRAM memories can be used instead of SRAM memories, with increased density and reduced leakage. More compact systems can be implemented using the integrated circuits.
机译:一种或多种集成电路,包括以DRAM制造工艺制造的至少一个集成电路。 DRAM制造的集成电路中的电容器可用于去耦集成电路的逻辑组件,并可用于细粒度的片上PMU。在一个实施例中,电容器可以物理地放置在电容器为其提供去耦电容的逻辑组件附近。在一个实施例中,电容器可以是至少两个电容器或至少一个电容器和开关的串联连接,以在面对缺陷时提供去耦电容。可以使用嵌入式DRAM存储器代替SRAM存储器,从而提高了密度并减少了泄漏。使用集成电路可以实现更紧凑的系统。

著录项

  • 公开/公告号US9607680B2

    专利类型

  • 公开/公告日2017-03-28

    原文格式PDF

  • 申请/专利权人 APPLE INC.;

    申请/专利号US201414196793

  • 发明设计人 SANJAY DABRAL;

    申请日2014-03-04

  • 分类号G11C11/4074;H01L25/065;H01L23/64;H01L23/522;H01L27/108;H01L49/02;H01L23/498;G11C7/02;G11C5/14;G11C29/02;H01L23/00;H01L25/18;

  • 国家 US

  • 入库时间 2022-08-21 13:42:23

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