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eDRAM-type semiconductor device including logic circuit section featuring large capacitance capacitor, and capacitor DRAM section featuring small capacitance capacitor

机译:eDRAM型半导体器件,包括具有大电容电容器的逻辑电路部分和具有小电容电容器的电容器DRAM部分

摘要

In an eDRAM-type semiconductor device, a dynamic random access memory (DRAM) section and a logic circuit section are formed on a semiconductor substrate, and an insulating layer is formed on the semiconductor substrate. A first capacitor is formed in the insulating layer at the DRAM section, the first capacitor defining a part of memory cell of the DRAM section. A second capacitor is formed in the insulating layer at the logic circuit section. The first capacitor comprises a lower electrode layer formed on an inner wall face of a hole formed in the insulating layer, and the second capacitor comprises a first lower electrode layer portion formed on an inner wall face of a groove formed in the insulating layer, and a second lower electrode layer portion formed on a surface of the insulating layer so as to be integrated with the first lower electrode portion.
机译:在eDRAM型半导体器件中,动态随机存取存储器(DRAM)部分和逻辑电路部分形成在半导体衬底上,并且绝缘层形成在半导体衬底上。在DRAM部分的绝缘层中形成第一电容器,该第一电容器限定了DRAM部分的存储单元的一部分。在逻辑电路部分的绝缘层中形成第二电容器。第一电容器包括形成在绝缘层中形成的孔的内壁表面上的下电极层,第二电容器包括形成在绝缘层中形成的凹槽的内壁表面上的第一下电极层部分,和第二下部电极层部分形成在绝缘层的表面上,以便与第一下部电极部分集成。

著录项

  • 公开/公告号US7952130B2

    专利类型

  • 公开/公告日2011-05-31

    原文格式PDF

  • 申请/专利权人 SHINTARO ARAI;

    申请/专利号US20060356006

  • 发明设计人 SHINTARO ARAI;

    申请日2006-02-17

  • 分类号H01L29/94;

  • 国家 US

  • 入库时间 2022-08-21 18:08:57

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