首页> 外文期刊>IEEE transactions on very large scale integration (VLSI) systems >Thermal-ADI - a linear-time chip-level dynamic thermal-simulation algorithm based on alternating-direction-implicit (ADI) method
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Thermal-ADI - a linear-time chip-level dynamic thermal-simulation algorithm based on alternating-direction-implicit (ADI) method

机译:Thermal-ADI-基于交替方向隐式(ADI)方法的线性时间芯片级动态热仿真算法

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摘要

Due to the dramatic increase of clock frequency and integration density, power density and on-chip temperature in high-end very large scale integration (VLSI) circuits rise significantly. To ensure the timing correctness and the reliability of high-end VLSI design, efficient and accurate chip-level transient thermal simulations are of crucial importance. In this paper, we develop and present an efficient transient thermal-simulation algorithm based on the alternating-direction-implicit (ADI) method. Our algorithm, thermal-ADI, not only has a linear run time and memory requirement , but is also unconditionally stable, which ensures that time step is not limited by any stability requirement. Extensive experimental results show that our algorithm is not only orders of magnitude faster than the traditional thermal-simulation algorithms, but also highly accurate and efficient in memory usage.
机译:由于时钟频率和集成密度的急剧增加,高端超大规模集成(VLSI)电路中的功率密度和片上温度显着上升。为了确保高端VLSI设计的时序正确性和可靠性,高效而准确的芯片级瞬态热仿真至关重要。在本文中,我们开发并提出了一种基于交替方向隐式(ADI)方法的高效瞬态热模拟算法。我们的算法即热ADI,不仅具有线性的运行时间和存储要求,而且是无条件稳定的,从而确保时间步长不受任何稳定性要求的限制。大量的实验结果表明,我们的算法不仅比传统的热模拟算法快几个数量级,而且在内存使用方面也非常准确和高效。

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