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首页> 外文期刊>Very Large Scale Integration (VLSI) Systems, IEEE Transactions on >An 8M Polygons/s 3-D Graphics SoC With Full Hardware Geometric and Rendering Engine for Mobile Applications
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An 8M Polygons/s 3-D Graphics SoC With Full Hardware Geometric and Rendering Engine for Mobile Applications

机译:具有用于移动应用的完整硬件几何和渲染引擎的8M多边形/ s 3-D图形SoC

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摘要

A 3-D graphics SoC, with a multi-layer advanced microcontroller bus architecture (AMBA) system, full pipelined hardware 3-D graphics accelerator, and clock/power management is proposed as a 49-mm $^{2}$ die for 180-nm CMOS technology. This system-on-chip (SoC) minimizes power consumption with a clock/power management unit according to its operation mode and applications. The 3-D graphics accelerator has a full pipelined architecture which improves full 3-D graphics performance to 8M polygons/s and consumes 108 mW at 100 MHz and 1.8 V. The LCD bypass mode and power-down mode consume 4.32 mW and 180 uW, respectively. The 3-D graphics accelerator also supports stereoscopic 3-D function with an alternative left-right drawing method and achieves a 59% improvement in 3DG performance compared to previous work.
机译:建议使用具有多层高级微控制器总线体系结构(AMBA)系统,全流水线硬件3-D图形加速器和时钟/电源管理的3-D图形SoC作为49毫米$ ^ {2} $芯片,用于180纳米CMOS技术。该片上系统(SoC)可以根据时钟/电源管理单元的工作模式和应用将功耗降至最低。 3-D图形加速器具有完整的流水线架构,可将完整的3-D图形性能提高到8M多边形/秒,在100 MHz和1.8 V时消耗108mW。LCD旁路模式和掉电模式消耗4.32 mW和180 uW。 , 分别。 3-D图形加速器还通过可选的左右绘图方法支持立体3-D功能,与以前的工作相比,3DG性能提高了59%。

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