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L1–L2 Interconnect Design Methodology and Arbitration in 3-D IC Multicore Compute Clusters

机译:3-D IC多核计算群集中的L1–L2互连设计方法和仲裁

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摘要

We introduce a novel 3-D implementation of the interconnect between cores and shared L2 cache banks for multicore clusters. The 3-D structure extends cluster sizes that can be supported with tolerable wire delays. As a result of the shorter connections achieved by splitting existing 2-D design into four layers, performance is improved and area and power are reduced. The splitting enables implementation of a better arbitration scheme, which leads to additional performance improvement.
机译:我们为多核群集介绍了内核与共享L2缓存组之间互连的新颖3-D实现。 3-D结构扩展了群集大小,可以通过可容忍的线路延迟来支持。通过将现有的2-D设计分成四个层,可以缩短连接时间,从而提高了性能,并减少了面积和功耗。拆分可以实现更好的仲裁方案,从而进一步提高性能。

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