首页> 外文期刊>IEEE transactions on very large scale integration (VLSI) systems >Novel Circuit-Level Model for Gate Oxide Short and its Testing Method in SRAMs
【24h】

Novel Circuit-Level Model for Gate Oxide Short and its Testing Method in SRAMs

机译:SRAM中短路的新型电路级模型及其测试方法

获取原文
获取原文并翻译 | 示例

摘要

Gate oxide short (GOS) has become a common defect for advanced technologies as the gate oxide thickness of a MOSFET is greatly reduced. The behavior of a GOS-impacted MOSFET is, however, complicated and difficult to be accurately modeled at the circuit level. In this paper, we first build a golden model of a GOS-impacted MOSFET by using technology CAD, and identify the limitation and inaccuracy of the previous GOS models. Next, we propose a novel circuit-level GOS model which provides a higher accuracy of its dc characteristics than any of the previous models and being is able to represent a minimum-size GOS-impacted MOSFET. In addition, the proposed model can fit the transient characteristics of a GOS by considering the capacitance change of the GOS-impacted MOSFET, which has not been discussed in previous work. Last, we utilize our proposed GOS model to develop a novel GOS test method for SRAMs, which can effectively detect the GOS defects usually escaped from the conventional IDDQ test and March test.
机译:由于MOSFET的栅极氧化层厚度大大减小,因此栅极氧化层短路(GOS)已成为先进技术的常见缺陷。但是,受GOS影响的MOSFET的行为复杂且难以在电路级别上精确建模。在本文中,我们首先使用技术CAD建立了受GOS影响的MOSFET的黄金模型,并确定了以前的GOS模型的局限性和不准确性。接下来,我们提出了一种新颖的电路级GOS模型,该模型具有比以前的任何模型更高的直流特性精度,并且能够代表最小尺寸的受GOS影响的MOSFET。此外,所提出的模型可以通过考虑受GOS影响的MOSFET的电容变化来拟合GOS的瞬态特性,这在先前的工作中并未进行讨论。最后,我们利用我们提出的GOS模型为SRAM开发一种新颖的GOS测试方法,该方法可以有效检测通常从常规IDDQ测试和March测试中逃脱的GOS缺陷。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号