机译:在CPU-GPU平台上进行液体冷却的3-D集成电路的并行热分析
Dept. of Electr. Eng., Univ. of California at Riverside, Riverside, CA, USA;
finite difference methods; graphics processing units; partial differential equations; thermal analysis; three-dimensional integrated circuits; 3D-integrated circuits; CPU-GPU platforms; CPU-graphic processing unit platforms; generalized minimum residual method; intertier liquid cooling microchannels; parallel GPU-GMRES solver; parallel finite difference-based thermal simulation algorithm; partial differential equations; physics-based heat equations; Graphics processing units; Heating; Integrated circuit modeling; Liquid cooling; Mathematical model; Thermal analysis; Vectors; 3-D-integrated circuit (IC); finite difference; generalized minimum residual method (GMRES); graphic processing unit (GPU) parallel computing; thermal analysis; thermal analysis.;
机译:具有硅通孔的3D集成电路热性能分析的有效方法
机译:3-D集成电路中热耦合的实验分析
机译:使用高清功率模糊技术对3D集成电路进行结级热分析
机译:用于集成电路3-D热分析的混合随机游走算法
机译:3D集成电路液体冷却测试平台的设计和制造
机译:使用具有生物纳米孔的CMOS集成电路开发的大规模平行分子分析平台
机译:基于微通道的液体冷却3D集成电路的热管理
机译:用于VLsI / VHsIC(超大规模集成电路/超高速集成电路)的高级封装应用:电气,热学和机械方面的考虑 - IR&D报告