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Parallel Thermal Analysis of 3-D Integrated Circuits With Liquid Cooling on CPU-GPU Platforms

机译:在CPU-GPU平台上进行液体冷却的3-D集成电路的并行热分析

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In this brief, we propose an efficient parallel finite difference-based thermal simulation algorithm for 3-D-integrated circuits (ICs) using generalized minimum residual method (GMRES) solver on CPU-graphic processing unit (GPU) platforms. First, the new method starts from basic physics-based heat equations to model 3-D-ICs with intertier liquid cooling microchannels and directly solves the resulting partial differential equations. Second, we develop a new parallel GPU-GMRES solver to compute the resulting thermal systems on a CPU-GPU platform. We also explore different preconditioners (implicit and explicit) and study their performances on thermal circuits and other types of matrices. Experimental results show the proposed GPU-GMRES solver can deliver orders of magnitudes speedup over the parallel LU-based solver and up to 4× speedup over CPU-GMRES for both dc and transient thermal analyzes on a number of thermal circuits and other published problems.
机译:在本简介中,我们在CPU图形处理单元(GPU)平台上使用广义最小残差法(GMRES)求解器为3-D集成电路(IC)提出了一种有效的基于并行有限差分的热仿真算法。首先,新方法从基于物理的基本热方程式开始,以具有层间液体冷却微通道的3-D-IC模型为模型,并直接求解所得的偏微分方程式。其次,我们开发了一个新的并行GPU-GMRES求解器,以在CPU-GPU平台上计算所得的热系统。我们还将探索不同的预处理器(隐式和显式),并研究它们在热回路和其他类型矩阵上的性能。实验结果表明,针对大量热电路和其他已发布问题的直流和瞬态热分析,所提出的GPU-GMRES求解器可以在基于并行LU的求解器上提供数量级的加速,并且比CPU-GMRES可以提供​​高达4倍的加速。

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