首页> 外文期刊>Very Large Scale Integration (VLSI) Systems, IEEE Transactions on >Modeling and Crosstalk Evaluation of 3-D TSV-Based Inductor With Ground TSV Shielding
【24h】

Modeling and Crosstalk Evaluation of 3-D TSV-Based Inductor With Ground TSV Shielding

机译:具有接地TSV屏蔽的基于3D TSV的电感器的建模和串扰评估

获取原文
获取原文并翻译 | 示例

摘要

In this paper, we present a novel through-silicon-via (TSV)-based 3-D inductor structure with ground TSV shielding for better noise performance. In addition, a circuit model is proposed for the inductor, which can reduce the simulation time over finite-element-based 3-D full-wave simulation. Rigorous 3-D full-wave simulation is performed up to 10 GHz to validate the circuit model. The ground TSV-based 3-D inductor is found to be resilient to TSV-TSV crosstalk noise compared with conventional 3-D inductors. The simulation results revealed that more than -33 dB of isolation can be achieved at 2 GHz between the 3-D inductor and the noise probe.
机译:在本文中,我们介绍了一种新颖的基于硅通孔(TSV)的3-D电感器结构,该结构具有接地TSV屏蔽,以实现更好的噪声性能。此外,针对电感器提出了一种电路模型,与基于有限元的3D全波仿真相比,该模型可以减少仿真时间。在高达10 GHz的频率下进行严格的3-D全波仿真,以验证电路模型。与传统的3D电感器相比,基于TSV的3D接地电感器可抵抗TSV-TSV串扰噪声。仿真结果表明,在3 GHz电感器和噪声探头之间,在2 GHz时可以实现-33 dB以上的隔离。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号