防串扰的3D芯片TSV自动布局

摘要

A crosstalk-free 3D IC through silicon via (TSV) automatic placement algorithm is presented in this paper. The principle of TSV crosstalk and the effectiveness of grounded TSV shielding was proved by using Comsol. Then effectiveness of grounded TSV was quantified with a deduced formula. Power/Ground TSV and signal TSV placement algorithm has been realized, considering the impact of TSV percentage and pinch constraint on 3D IC performance. Finally, the experimental results on IBM benchmark circuits validated and verified the proposed algorithm.%为了防止3D芯片中的硅过孔(TSV)串扰,提出一种TSV自动排布算法.该算法结合TSV串扰的机理,利用Comsol证明了通过接地TSV解决屏蔽方法的有效性,完成了对接地TSV屏蔽效果的量化；提出电源/接地TSV和信号TSV自动排布算法,其中考虑了不同类型TSV比例和工艺最小间距对3D芯片性能的影响.最后利用IBM基准电路进行仿真,结果表明,文中算法可以防串扰的目的对电路中TSV进行自动布局.