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Performance Degradation of Automotive Power MOSFETs Under Repetitive Avalanche Breakdown Test

机译:在重复雪崩击穿测试下的汽车电源MOSFET的性能下降

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Avalanche ruggedness is one of the key factors for safe and reliable power converters deployed in various automotive subsystems. In this article, the avalanche capability of power MOSFETs is tested under different repetitive avalanche conditions to differentiate the die degradation and package degradation. While examining the degradation mechanisms, the corresponding electrical parameter shifts are analyzed to better understand the structural changes and root causes and identify potential precursors for condition monitoring. For this purpose, a high-resolution and cost-effective nanosecond current pulse generator (CPG) is designed. Due to the high-resolution pulsewidth modulation function of a digital signal processor (DSP), short current pulses can be generated in the order of 100 ps where the magnitude and duration of the current pulsewidth can be adjusted precisely. During the experiments, power MOSFETs are stressed under two different pulsewidths. It is observed that the ON-state resistance gradually increases in both cases, yet the roots of the degradations are different. The die degradation and package degradation are responsible for the changes in short pulse and long pulse, respectively. In the short pulse case, some devices show saturation in drain leakage current and ON-state resistance, while some others show a significant threshold voltage drop, which leads to a noticeable shift of transfer and output characteristics. The electrical parameter shifts indicate a possible gate degradation after the device aging. At the end of the tests, failure analyses are conducted on both devices under test (DUTs) under different stress conditions, revealing different failure mechanisms.
机译:雪崩坚固性是在各种汽车子系统中部署的安全且可靠的电源转换器的关键因素之一。在本文中,在不同重复的雪崩条件下测试功率MOSFET的雪崩能力,以区分模具降解和包装降解。在检查劣化机制的同时,分析相应的电参数偏移以更好地理解结构变化和根本原因并识别条件监测的潜在前体。为此目的,设计了一种高分辨率和经济高效的纳秒电流脉冲发生器(CPG)。由于数字信号处理器(DSP)的高分辨率脉冲宽度调制功能,可以大约为100ps产生短电流脉冲,其中可以精确地调整电流脉冲宽的幅度和持续时间。在实验期间,功率MOSFET在两个不同的脉冲下压力。观察到,在两种情况下,导通抗性逐渐增加,但降解的根部是不同的。模具劣化和包装劣化分别对短脉冲和长脉冲的变化负责。在短脉冲外壳中,一些器件显示出漏极漏电流和导通电阻的饱和度,而其他一些则显示出显着的阈值电压降,这导致转移和输出特性的显着偏移。电气参数换档表示设备老化后可能的栅极劣化。在测试结束时,在不同的压力条件下,在测试(DUT)的两个设备上进行故障分析,揭示不同的失效机制。

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