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Interfacial Microstructure and Reaction Phases in Si_3N_4/Si_3N_4 Joints Brazed with Cu-Zn-Ti Filler Alloy

机译:Cu-Zn-Ti填充合金钎焊Si_3N_4 / Si_3N_4接头的界面组织和反应相

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摘要

Si_3N_4 ceramic was jointed to itself using (CuZn)85Ti15 filler alloy at 1123-1323 K for 0.9 ks. TEM observation showed that a reaction zone of TIN and/or Ti_2N exists at the interface between the ceramic and filler alloy. When the brazing temperature is lower than 1223 K, the interfacial reaction zone is mainly composed of Ti_2N, which has cylindrical shape and is randomly orientate in the zone. There is a crystal orientation relationship between the Ti_2N in the reaction zone and the Cu in the Cu-Zn solid solution, which is: {110} _(Ti2N)//{420}_(Cu),<001>_(Ti2N)//<001>_(Cu). When the brazing temperature is higher than 1223 K, the interfacial zone is composed of TiN, which has plate shapes crossing each other.
机译:使用(CuZn)85Ti15填充合金在1123-1323 K焊接0.9 ks来连接Si_3N_4陶瓷。 TEM观察表明,在陶瓷和填充合金之间的界面处存在TIN和/或Ti_2N的反应区。当钎焊温度低于1223 K时,界面反应区主要由Ti_2N组成,Ti_2N呈圆柱状并在该区域随机取向。反应区中的Ti_2N与Cu-Zn固溶体中的Cu之间存在晶体取向关系,即:{110} _(Ti2N)// {420} _(Cu),<001> _(Ti2N )// <001> _(Cu)。当钎焊温度高于1223K时,界面区域由TiN组成,其具有彼此交叉的板状。

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