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Growth And Characterization Of Sputtered Lanio_3 Films Obtained With (la_2nio_4+ni) Cermet Targets

机译:(la_2nio_4 + ni)金属陶瓷靶材获得的溅射Lanio_3薄膜的生长和表征

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LaNiO_3 films were prepared by magnetron sputtering at 100-400 ℃ and 50-100 W with two (La_2NiO_4+Ni) cermet targets; one had the La/Ni molar ratio of 1:1 and the other 1:1.355. The as-grown films were post-annealed at 700 ℃ for 20 min. Different film compositions and properties were obtained from the different process parameters including target composition, deposition temperature, and r.f. plasma power. The variations of crystallization, microstructure, and electrical resistivity with process parameters were explained by film composition. The Ni-deficient films had a tendency to form other La-rich second phases embedded in a nonstoichiometric LaNiO_3 matrix. Our post-annealed LaNiO_3 films obtained from target B had low resistivity of 0.34× 10~(-3) Ω cm.
机译:在100-400℃和50-100 W的磁控溅射条件下,用两个(La_2NiO_4 + Ni)金属陶瓷靶制备LaNiO_3薄膜;一种是La / Ni摩尔比为1:1,另一种是1:1.355。将生长的薄膜在700℃下进行20分钟后退火。从不同的工艺参数获得不同的膜组成和性能,这些工艺参数包括目标组成,沉积温度和r.f.。等离子功率。薄膜组成解释了结晶度,微观结构和电阻率随工艺参数的变化。缺乏镍的薄膜具有形成嵌入非化学计量的LaNiO_3基质中的其他富La第二相的趋势。我们从靶材B获得的退火后LaNiO_3膜具有0.34×10〜(-3)Ωcm的低电阻率。

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