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Growth and characterization of silicon carbide thin films using a nontraditional hollow cathode sputtering technique.

机译:使用非传统空心阴极溅射技术生长和表征碳化硅薄膜。

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摘要

Silicon carbide (SiC) is considered a suitable candidate for high-power, high-frequency devices due to its wide bandgap, high breakdown field, and high electron mobility. It also has the unique ability to synthesize graphene on its surface by subliming Si during an annealing stage. The deposition of SiC is most often carried out using chemical vapor deposition (CVD) techniques, but little research has been explored with respect to the sputtering of SiC.;Investigations of the thin film depositions of SiC from pulse sputtering a hollow cathode SiC target are presented. Although there are many different polytypes of SiC, techniques are discussed that were used to identify the film polytype on both 4H-SiC substrates and Si substrates. Results are presented about the ability to incorporate Ge into the growing SiC films for the purpose of creating a possible heterojunction device with pure SiC. Efforts to synthesize graphene on these films are introduced and reasons for the inability to create it are discussed. Analysis mainly includes crystallographic and morphological studies about the deposited films and their quality using x-ray diffraction (XRD), reflection high energy electron diffraction (RHEED), transmission electron microscopy (TEM), scanning electron microscopy (SEM), atomic force microscopy (AFM), Auger electron spectroscopy (AES) and Raman spectroscopy. Optical and electrical properties are also discussed via ellipsometric modeling and resistivity measurements. The general interpretation of these analytical experiments indicates that the films are not single crystal. However, the majority of the films, which proved to be the 3C-SiC polytype, were grown in a highly ordered and highly textured manner on both (111) and (110) Si substrates.
机译:碳化硅(SiC)具有宽的带隙,高击穿场和高电子迁移率,因此被认为是高功率,高频设备的合适选择。通过在退火阶段升华Si,它还具有在其表面合成石墨烯的独特能力。 SiC的沉积通常是使用化学气相沉积(CVD)技术进行的,但有关SiC溅射的研究很少。脉冲中空阴极SiC靶的脉冲溅射SiC薄膜沉积的研究正在进行中。提出了。尽管SiC有许多不同的多型体,但仍讨论了用于识别4H-SiC衬底和Si衬底上的薄膜多型体的技术。提出了有关将Ge掺入生长的SiC膜中的能力的结果,以创建可能的纯SiC异质结器件。介绍了在这些薄膜上合成石墨烯的工作,并讨论了无法生成石墨烯的原因。分析主要包括使用X射线衍射(XRD),反射高能电子衍射(RHEED),透射电子显微镜(TEM),扫描电子显微镜(SEM),原子力显微镜对沉积膜及其质量进行晶体学和形态学研究( AFM),俄歇电子能谱(AES)和拉曼光谱。还通过椭偏模型和电阻率测量讨论了光学和电学性质。这些分析实验的一般解释表明,这些膜不是单晶的。但是,大多数被证明是3C-SiC多型的薄膜都是在(111)和(110)Si衬底上以高度有序和高度纹理化的方式生长的。

著录项

  • 作者

    Huguenin-Love, James.;

  • 作者单位

    The University of Nebraska - Lincoln.;

  • 授予单位 The University of Nebraska - Lincoln.;
  • 学科 Engineering Electronics and Electrical.
  • 学位 Ph.D.
  • 年度 2010
  • 页码 245 p.
  • 总页数 245
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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