Reliability of Fine-Pitch Flip-Chip (COG) Bonding with Non-Conductive Film Using Ultrasonic Energy

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Reliability of Fine-Pitch Flip-Chip (COG) Bonding with Non-Conductive Film Using Ultrasonic Energy

机译：使用超声波能量与非导电膜的细间距倒装芯片（COG）键合的可靠性

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《The Journal of Adhesion》 |2010年第6期|p.470-479|共10页
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正文语种 eng
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关键词
Chip on glass (COG); Copper bump; Die-shear-test; Flip-chip; Non-conductive film; Reliability test; Ultrasonic bonding;

机译：玻璃上芯片（COG）;铜凸点;模切测试;倒装芯片非导电膜;可靠性测试;超声波粘接;

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1. Reliability of Fine-Pitch Flip-Chip (COG) Bonding with Non-Conductive Film Using Ultrasonic Energy [J] . Jung-Lae Jo, Jong-Bum Lee, Jong-Min Kim The Journal of Adhesion . 2010,第4a6期

机译：超声波能量与非导电膜的细间距倒装芯片（COG）键合的可靠性
2. Reliability of assembly of chips and flex substrates using thermosonic flip-chip bonding process with a non-conductive paste [J] . Cheng-Li Chuang, Wei-How Chen, Hsun-Tien Li, Microelectronic Engineering . 2010,第11期

机译：使用具有非导电性糊剂的热超声倒装芯片键合工艺来可靠地组装芯片和柔性基板
3. Effect of Non-conductive Film on the Reliability of Multi-chip Package Bonded Using Ultrasonic Energy [J] . Jong-Bum Lee, Jong-Gun Lee, Sang-Su Ha Journal of Adhesion Science and Technology: The International Journal of Theoredtical and Basic Aspects of Adhesion Science and Its Applications in All Areas of Technology . 2011,第18期

机译：非导电膜对超声能焊接多芯片封装可靠性的影响
4. New Flip-Chip Bonding Technology NSD (Non-Conductive Film Stud-Bump Direct Interconnection) Method Using Resin Encapsulation Sheet ―Examination of Material Physical Properties and Joint Reliability by FEM ― [C] . Kazuto Nishida, Hidenobu Nishikawa, Kazumichi Shimizu, The Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference amp; Exhibition Jul 8-13, 2001, Kauai, Hawaii . 2001

机译：使用树脂封装片的新型倒装芯片键合技术NSD（非导电膜柱形凸点直接互连）方法―通过FEM检查材料物理性能和接头可靠性―
5. Characterization and reliability analysis of wedge wire bonds inside a package subjected to ultrasonic welding and thermal cycling. [D] . Battaglia, James A. 2007

机译：经过超声焊接和热循环的封装内部楔形丝焊的特性和可靠性分析。
6. Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components [O] . Mohd Nizam Ab. Rahman, Noor Suhana Mohd Zubir, Raden Achmad Chairdino Leuveano, 2014

机译：锡膏合金的可靠性研究以改善表面安装细间距元件的焊点
7. Validation of Design Factors for Fine-Pitch Flip-Chip Joint Reliability Consisting of an Adhesive Film [O] . Naotaka TANAKA, Kenya KAWANO, Takahiro NAITO 2005

机译：验证由粘合膜组成的细距倒装芯片关节可靠性的设计因子

Reliability of Fine-Pitch Flip-Chip (COG) Bonding with Non-Conductive Film Using Ultrasonic Energy

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