首页> 外文期刊>Surface Science >Band-energy estimation on silicon cap annealed 4H-SiC surface using hard X-ray photoelectron spectroscopy
【24h】

Band-energy estimation on silicon cap annealed 4H-SiC surface using hard X-ray photoelectron spectroscopy

机译:硬X射线光电子谱对硅帽退火4H-SIC表面的带节能估计

获取原文
获取原文并翻译 | 示例
           

摘要

Silicon-cap annealing (SiCA) emerged as a promising silicidation-less ohmic contact formation method that can solve the crucial reliability limitation of ohmic contacts formed with metals; this limitation was due to carbon aggregation introduced during silicidation annealing. However, no previous study for a complete understanding of SiCA effects on the metal/SiC exists. In this study, the band-energy state of silicidation-less ohmic contacts formed by SiCA-SiC is directly estimated using hard X-ray photoelectron spectroscopy (HAXPES). The results show that Si-dot formation on the SiC surface reduces the contacts resistivity, and ohmic contact behavior is still observed even after Si-dot removal. A peak position analysis of Si 1 s orbit using HAXPES shows a clear increase in the band energy under various SiC surface conditions. Particularly, the Al/SiCA-SiC sample shows a peak shift of 0.765 eV. This strong potential barrier lowering the derived formation of the thin-depletion layer and low potential barrier on Al/SiCA-SiC junction. Moreover, the observations made using HAXPES, and transmission electron microscopy, suggest that the modification of the outer-most surface layer plays an essential role in the ohmic contact formation. These results provide insights on the ohmic contact formation mechanism for wide-band-gap semiconductor materials.
机译:硅盖退火(SICA)作为有希望的硅化含硅化欧姆接触形成方法,可以解决与金属形成的欧姆触点的关键可靠性限制;这种限制是由于硅化退火期间引入的碳聚集。然而,以前没有关于完全了解金属/ SIC的SICA效应的研究。在该研究中,使用硬X射线光电子能谱(HAXPE)直接估计由SICS-SiC形成的硅化的含硅的带节能状态。结果表明,SiC表面上的Si-Dot形成降低了触点电阻率,甚至在Si-Dot去除后仍观察到欧姆接触行为。使用HAXPES的SI 1 S轨道的峰值位置分析显示各种SIC表面条件下的带能量的透明增加。特别是,Al / SICA-SIC样品显示0.765eV的峰值偏移。这种强大的潜在屏障降低了薄耗尽层的衍生形成和Al / Sica-SiC结的低电位屏障。此外,使用HAXPES和透射电子显微镜制造的观察结果表明,外部表面层的改变在欧姆接触形成中起重要作用。这些结果提供了对宽带间隙半导体材料的欧姆接触形成机制的见解。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号