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Characterization of silicon dioxide films on 4H-SiC Si (0001) face by cathodoluminescence spectroscopy and x-ray photoelectron spectroscopy

机译:阴极发光光谱和X射线光电子能谱表征4H-SiC Si(0001)面上的二氧化硅膜

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摘要

We measured cathodoluminescence (CL) spectra of SiO2 films grown on 4H-SiC wafers and found that for an acceleration voltage of 5 kV, CL peaks at 460 and 490 nm, assigned to oxygen vacancy centers (OVCs), become weak by post-oxidation annealing in N2O ambient at 1300℃ whereas the CL peak around 580 nm, related to Si-N bonding structures, becomes intense. Furthermore, the peak assigned to N-Si3 configurations in x-ray photoelectron spectroscopy (XPS) spectra was observed in the SiO2/SiC interface in only samples annealed in N2O ambient. These results suggest that the interface trap densities decrease and the channel mobility in n-type MOS capacitors increases by the termination of dangling bonds by the N atom in the SiO2/SiC interface. CL spectroscopy and XPS provide us with extensive information on OVCs and dangling bonds in the SiO2/SiC interface on the 4H-SiC substrate.
机译:我们测量了在4H-SiC晶片上生长的SiO2膜的阴极发光(CL)光谱,发现在5 kV的加速电压下,分配给氧空位中心(OVC)的460和490 nm处的CL峰由于后氧化而变得微弱在1300℃的N2O环境中退火,而与Si-N键结构有关的CL峰在580 nm附近变得很强。此外,仅在N2O环境中退火的样品中,在SiO2 / SiC界面中观察到了在X射线光电子能谱(XPS)光谱中分配给N-Si3构型的峰。这些结果表明,通过SiO2 / SiC界面中的N原子终止悬空键,界面陷阱密度降低,n型MOS电容器中的沟道迁移率增加。 CL光谱学和XPS为我们提供了有关4H-SiC衬底上SiO2 / SiC界面中的OVC和悬空键的广泛信息。

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