Conductive polymer interconnections for three-dimensional computing structures

摘要

Research into 3D nanocomputing structures is important for the development of the next generation of computers. The main task in constructing a 3D chip stack is to vertically connect existing 2D chips. Hence we have developed molecular wiring technology which allows for high-density interconnections, and which will be appropriate for nanoelectronics. First we solve the problem of making wires between contact pads on two chips, but with no cross-talk between the pads. The chosen interconnect materials are conductive organic polymers, grown in the pores of insulating membranes. The growth of polymer in the membrane pores is investigated with the aim of achieving good conductivity through the pores, but with small cross-talk between them.