Design and Assembly of BGAs and Voiding Requirements: IPC 7095 B

摘要

IPC 7095 B "Design and Assembly Process Implementation for BGAs" was released, but already we have started its revision due to our fast-paced, changing industry. This document describes the design and assembly challenges for implementing BGAs and CSPs, inspection, repair and reliability issues associated with BGAs. The critical issue of black pad associated with electroless immersion nickel gold (ENIG) has been described in detail. Target audiences for this document are managers, design and process engineers, as well as operators and technicians who deal with electronics assembly, inspection and repair processes. The intent is to provide useful and practical information to the industry. There were several people who contributed to IPC-7095 development, but IPC recognized key contributors for this document as Dr. Aspandiar of Intel, Rob Rowland of Radisys, Helen Lowe of Celestica, Vern Solberg of Tessera and Linda Woody of Lockheed Martin.