一种BGA器件的低温组装工艺方法

摘要

介绍了BGA焊接的一般方法，分析了BGA空洞产生的原因；针对高可靠应用场合需求，详细描述了一种可有效减少空洞发生的BGA低温焊接方法，并对采用这种方法焊接的BGA的焊点可靠性进行了分析。%Introduce a general method of the BGA soldering and analyze the reasons of the voids of BGA soldering. Focus on high reliability applications, a low temperature assembly process which reduces effectively voids of BGA soldering has been described in detail. Analyze the reliability of BGA solder joints soldered by this method.