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首页> 外文期刊>Superlattices and microstructures >Fabrication of preferential orientation ZnO thin films with exposed holes by high temperature annealing low-temperature-grown ZnO thin films on different substrates
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Fabrication of preferential orientation ZnO thin films with exposed holes by high temperature annealing low-temperature-grown ZnO thin films on different substrates

机译:通过在不同基板上进行低温退火低温生长的ZnO薄膜来制造带有外露孔的优先取向ZnO薄膜

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摘要

In this work, we report that (001) preferential orientation ZnO thin films with exposed holes grown on Si(100), Si(111) and sapphire(001) substrates by magnetron sputtering are fabricated high temperature annealing. It is found that the ZnO thin films with exposed holes grown on Si (100) and sapphire(001) substrates only represent (001) orientation hexagonal structure ZnO, while the ZnO thin films with exposed holes grown on Si(111) substrates not only show (001) orientation hexagonal structure ZnO but also exhibit cubic sphalerite structure ZnO. It is also found that the density of the exposed holes for the ZnO thin films grown on Si(100) and Si(111) substrates are of appropriately 1.74 x 10(8) cm(-2) and 0.85 x 10(8) cm(-2), respectively, but 0.04 x 10(8) cm(-2) for the ZnO thin films grown on sapphire(001) substrates. Meanwhile, the size (about 300-450 nm) of the exposed holes for the ZnO thin films on Si(111) substrates is bigger than that (similar to 180 nm) on Si(100) and sapphire(001) substrates. Further study reveals that the residual stress is significantly affected by the number of the holes on the ZnO surface, and the formation of the exposed holes is beneficial to reducing the residual stress: as the increase of the number and size of the exposed holes, the residual stress is reduced and changed from compress stress to tensile stress; further increase of those of the exposed holes results in larger tensile stress. Finally, formation model of the exposed holes on the ZnO thin films surface has also been proposed.
机译:在这项工作中,我们报告说,通过磁控溅射在高温Si(100),Si(111)和Sapphire(001)衬底上生长的(001)择优取向ZnO薄膜具有暴露的孔洞,并进行了高温退火处理。发现在Si(100)和蓝宝石(001)衬底上生长的带有裸露孔的ZnO薄膜仅表示(001)取向六方结构ZnO,而在Si(111)衬底上生长的带有裸露孔的ZnO薄膜不仅示出(001)取向的六方结构ZnO,但是还显示立方闪锌矿结构ZnO。还发现在Si(100)和Si(111)衬底上生长的ZnO薄膜的裸露孔密度分别为1.74 x 10(8)cm(-2)和0.85 x 10(8)cm (-2),但对于在蓝宝石(001)衬底上生长的ZnO薄膜而言,则为0.04 x 10(8)cm(-2)。同时,Si(111)衬底上的ZnO薄膜的暴露孔的尺寸(大约300-450 nm)大于Si(100)和蓝宝石(001)衬底上的暴露孔的尺寸(类似于180 nm)。进一步的研究表明,残余应力受ZnO表面上的孔数量显着影响,暴露的孔的形成有利于减少残余应力:随着暴露孔的数量和尺寸的增加,残余应力减小,并从压缩应力变为拉应力;裸露孔的进一步增加导致更大的拉伸应力。最后,提出了ZnO薄膜表面裸露孔的形成模型。

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