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Modification of electrical properties of Au-type InP Schottky diode with a high-k Ba_(0.6)Sr_(0.4)TiO_3 interlayer

机译:高k_Ba_(0.6)Sr_(0.4)TiO_3中间层对Au / n型InP肖特基二极管电学性能的影响

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Au/Ba_(0.6)Sr_(0.4)TiO_3 (BST)-InP metal/insulator/semiconductor (MIS) Schottky diodes have been analyzed by current-voltage (Ⅰ-Ⅴ) and capacitance-voltage (C-V) measurements. The surface morphology of the BST films on InP is fairly smooth. The Au/BST-InP MIS Schottky diode shows better rectification ratio and low leakage current compared to the conventional Au-InP metal-semiconductor (MS) Schottky diode. Higher barrier height is achieved for the MIS Schottky diode compared to the MS Schottky diode. The Norde and Cheung's methods are employed to determine the barrier height, ideality factor and series resistance. The interface state density (N_(SS)) is determined from the forward bias Ⅰ-Ⅴ data for both the MS and MIS Schottky diodes. Results reveal that the N_(SS) of the MIS Schottky diode is lower than that of the MS Schottky diode. The Poole-Frenkel emission is found dominating the reverse current in both Au-InP MS and Au/BST-InP MIS Schottky diodes, indicating the presence of structural defects and trap levels in the dielectric film.
机译:通过电流-电压(Ⅰ-Ⅴ)和电容-电压(C-V)测量对Au / Ba_(0.6)Sr_(0.4)TiO_3(BST)/ n-InP金属/绝缘体/半导体(MIS)肖特基二极管进行了分析。 InP上BST膜的表面形态相当光滑。与传统的Au / n-InP金属半导体(MS)肖特基二极管相比,Au / BST / n-InP MIS肖特基二极管具有更好的整流比和较低的漏电流。与MS肖特基二极管相比,MIS肖特基二极管具有更高的势垒高度。采用Norde和Cheung的方法确定势垒高度,理想因子和串联电阻。根据MS和MIS肖特基二极管的正向偏压Ⅰ-Ⅴ数据确定界面态密度(N_(SS))。结果表明,MIS肖特基二极管的N_(SS)低于MS肖特基二极管的N_(SS)。发现在Au / n-InP MS和Au / BST / n-InP MIS肖特基二极管中,普尔-弗伦克尔发射均占反向电流的主导,表明介电膜中存在结构缺陷和陷阱能级。

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