机译:反转,累积和无结模式体锗FinFET的研究
Department of Engineering and System Science, National Tsing Hua University, Hsinchu 300, Taiwan,Nano Science and Technology Program, Taiwan International Graduate Program, Academia Sinica, Taipei 115, Taiwan and National Tsing Hua University, Hsinchu 300, Taiwan,Device Modeling Croup, School of Engineering, University of Glasgow, Glasgow, Scotland, UK;
Device Modeling Croup, School of Engineering, University of Glasgow, Glasgow, Scotland, UK;
Device Modeling Croup, School of Engineering, University of Glasgow, Glasgow, Scotland, UK;
Device Modeling Croup, School of Engineering, University of Glasgow, Glasgow, Scotland, UK;
Device Modeling Croup, School of Engineering, University of Glasgow, Glasgow, Scotland, UK;
Device Modeling Croup, School of Engineering, University of Glasgow, Glasgow, Scotland, UK;
Department of Engineering and System Science, National Tsing Hua University, Hsinchu 300, Taiwan;
Department of Engineering and System Science, National Tsing Hua University, Hsinchu 300, Taiwan;
Department of Engineering and System Science, National Tsing Hua University, Hsinchu 300, Taiwan;
Department of Engineering and System Science, National Tsing Hua University, Hsinchu 300, Taiwan,Nano Science and Technology Program, Taiwan International Graduate Program, Academia Sinica, Taipei 115, Taiwan and National Tsing Hua University, Hsinchu 300, Taiwan;
Department of Engineering and System Science, National Tsing Hua University, Hsinchu 300, Taiwan;
Device Modeling Croup, School of Engineering, University of Glasgow, Glasgow, Scotland, UK,Gold Standard Simulations Ltd. (now part of Synopsys), Glasgow G3 7JT, Scotland, UK;
Germanium; Junctionless; FinFETs; 3D TCAD simulation; Quantum confinement effects;
机译:栅极长度为3nm的反相,累加和无结模式n型和p型体硅FinFET的性能
机译:翅片形状对无线累积模式散装料的模拟和RF性能的影响
机译:垫片工程技术,用于增强无结累积模式体FinFET的性能
机译:具有优化的3纳米纳米鳍结构的反转,累积和无结模式硅N型和P型体FinFET的特性
机译:批量累积和反转MOSFET进行缩放机会,用于千兆类集成
机译:体硅衬底上的新型14nm扇贝形FinFET(S-FinFET)
机译:研究反转,积累和无结模式体锗FinFET