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Improving breakdown voltage and self-heating effect for SiC LDMOS with double L-shaped buried oxide layers

机译:具有双L形掩埋氧化物层的SiC LDMOS的击穿电压和自热效应的改善

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摘要

In this paper, a SiC LDMOS with double L-shaped buried oxide layers (DL-SiC LDMOS) is investigated and simulated. The DL-SiC LDMOS consists of two L-shaped buried oxide layers and two SiC windows. Using 2-D numerical simulation software, Atlas, Silvaco TCAD, the breakdown voltage, and the self-heating effect are discussed. The double-L shaped buried oxide layers and SiC windows in the active area can introduce an additional electric field peak and make the electric field distribution more uniform in the drift region. In addition, the SiC windows, which connect the active area to the substrate, can facilitate heat dissipation and reduce the maximum lattice temperature of the device. Compared with the BODS structure, the DL-SiC LDMOS and BODS structures have the same device parameters, except of the buried oxide layers. The simulation results of DL-SiC LDMOS exhibits outstanding characteristics including an increase of the breakdown voltage by 32.6% to 1220 V, and a low maximum lattice temperature (535 K) at room temperature.
机译:本文研究并模拟了具有双L形埋入氧化物层的SiC LDMOS(DL-SiC LDMOS)。 DL-SiC LDMOS由两个L形掩埋氧化物层和两个SiC窗口组成。讨论了使用二维数值模拟软件Atlas,Silvaco TCAD,击穿电压和自热效应的问题。有源区域中的双L形掩埋氧化物层和SiC窗口可以引入额外的电场峰值,并使漂移区中的电场分布更加均匀。另外,将有源区连接到衬底的SiC窗口可以促进散热并降低器件的最大晶格温度。与BODS结构相比,DL-SiC LDMOS和BODS结构具有相同的器件参数,除了掩埋氧化物层。 DL-SiC LDMOS的仿真结果显示出出色的特性,包括击穿电压提高了32.6%至1220 V,并且在室温下具有较低的最大晶格温度(535 K)。

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