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Total ionizing dose damage in deep submicron partially depleted SOI MOSFETs induced by proton irradiation

机译:质子辐照在深亚微米部分耗尽的SOI MOSFET中造成的总电离剂量损伤

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摘要

This overview discusses the impact of ionizing irradiation on the static, the transient and the low-frequency noise characteristics of deep submicron partially depleted (PD) silicon-on-insulator (SOI) transistors. Tt is demonstrated that, while from a total ionizing dose (TID) damage viewpoint the technology is suitable for space applications, there is still a marked performance degradation. Evidence is provided that at least two basic mechanisms are involved. One is related to the radiation-induced hole trapping in the field oxide, giving rise to a subthreshold leakage current. In addition, the occurrence of majority carrier injection by electron valence-band (EVB) tunneling gives rise to some unexpected front-back channel coupling effects. A second yet unknown mechanism gives rise to a length-dependent response of the static device parameters, pointing to a laterally non-uniform charging of the gate oxide and/or the silicon body.
机译:本概述讨论了电离辐射对深亚微米部分耗尽(PD)绝缘体上硅(SOI)晶体管的静态,瞬态和低频噪声特性的影响。 Tt被证明,尽管从总电离剂量(TID)损害的角度来看,该技术适用于太空应用,但性能仍然明显下降。提供了至少涉及两个基本机制的证据。一个与场致氧化物中由辐射引起的空穴俘获有关,从而产生了低于阈值的泄漏电流。此外,通过电子价带(EVB)隧穿多数载流子注入会引起一些意想不到的前后通道耦合效应。第二种未知的机制引起了静态器件参数的长度相关响应,指向栅极氧化物和/或硅体的横向不均匀充电。

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