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Weak Cell Detection in Deep-Submicron SRAMs: A Programmable Detection Technique

机译:深亚微米SRAM中的弱单元检测:一种可编程检测技术

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Embedded SRAM bit count is constantly growing limiting yield in systems-on-chip (SoCs). As technology scales into deep sub-100-nm feature sizes, the increased defect density and process spreads make stability of embedded SRAMs a major concern. This paper introduces a digitally programmable detection technique, which enables detection of SRAM cells with compromised stability [with data retention faults (DRFs) being a subset]. The technique utilizes a set of cells to modify the bitline voltage, which is applied to a cell under test (CUT). The bitline voltage is digitally programmable and can be varied in wide range, modifying the pass/fail threshold of the technique. Programmability of the detection threshold allows tracking process variations and maintaining the optimal tradeoff between test quality and test yield. The measurement results of a test chip presented in the paper demonstrate the effectiveness of the proposed technique.
机译:嵌入式SRAM位数不断增长,从而限制了片上系统(SoC)的良率。随着技术扩展到100nm以下深的特征尺寸,增加的缺陷密度和工艺扩展使嵌入式SRAM的稳定性成为主要问题。本文介绍了一种数字可编程检测技术,该技术能够检测稳定性受到损害的SRAM单元[数据保留错误(DRF)是其子集]。该技术利用一组单元来修改位线电压,然后将其施加到被测单元(CUT)。位线电压是数字可编程的,可以在较大范围内变化,从而修改了该技术的通过/失败阈值。检测阈值的可编程性允许跟踪过程变化并在测试质量和测试成品率之间保持最佳平衡。本文提出的测试芯片的测量结果证明了该技术的有效性。

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