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首页> 外文期刊>IEEE Journal of Solid-State Circuits >An X- and Ku-Band 8-Element Phased-Array Receiver in 0.18-$mu{hbox{m}}$ SiGe BiCMOS Technology
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An X- and Ku-Band 8-Element Phased-Array Receiver in 0.18-$mu{hbox{m}}$ SiGe BiCMOS Technology

机译:采用0.18- $ mu {hbox {m}} $ SiGe BiCMOS技术的X和Ku频段8元素相控阵接收器

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摘要

This paper demonstrates an 8-element phased array receiver in a standard 0.18-$mu{hbox{m}}$ SiGe BiCMOS (1P6M, SiGe HBT ${f}_{t}approx 150 {hbox{GHz}}$) technology for X- and ${hbox{K}}u$-band applications. The array receiver adopts the All-RF architecture, where the phase shifting and power combining are done at the RF level. With the integrations of all the digital control circuitry and ESD protection for all I/O pads, the receiver consumes a current of 100 $sim$ 200 mA from a 3.3 V supply voltage. The receiver shows 1.5 $sim$ 24.5 dB of power gain per channel from a 50 $Omega$ load at 12 GHz with bias current control, and an associated NF of 4.2 dB (@ max. gain) to 13.2 dB (@ min. gain). The RMS gain error is $≪$ 0.9 dB and the RMS phase error is $≪6^{circ}$ at 6–18 GHz for all 4-bit phase states. The measured group delay is 162.5 $pm$ 12.5 ps for all phase states at 6–18 GHz. The RMS phase mismatch and RMS gain mismatch among the eight channels are $≪2.7^{circ}$ and 0.4 dB, respectively, for all 16 phase states, over 6–18 GHz. The 8-element array can operate instantaneously at any center frequency and with a wide bandwidth (3 to 6 GHz, depending on the center frequency) given primarily by the 3 dB gain variation in the 6–18 GHz range. To our knowledge, this is the first demonstration of an All-RF phased array on a silicon chip with very low RMS phase and gain errors at 6–18 GHz. The chip size is $2.2times 2.45 {hbox{mm}}^{2}$ including all pads.
机译:本文演示了采用标准0.18- $ mu {hbox {m}} $ SiGe BiCMOS(1P6M,SiGe HBT $ {f} _ {t}约150 {hbox {GHz}} $)技术的8元素相控阵接收机适用于X波段和$ {hbox {K}} u波段应用。阵列接收器采用全RF架构,其中相移和功率合并在RF级别完成。通过集成所有数字控制电路和所有I / O焊盘的ESD保护,接收器从3.3 V电源电压消耗的电流为100 $ sim $ 200 mA。接收器显示了在12 GHz时具有偏置电流控制的50Ω负载下每通道1.5 sim $ 24.5 dB的功率增益,相关的NF为4.2 dB(@最大增益)至13.2 dB(@最小增益)。 )。对于所有4位相位状态,在6–18 GHz时,RMS增益误差为$ ≪0.9 dB,RMS相位误差为$ ≪6 ^ circ。在6–18 GHz的所有相位下,测得的群延迟为162.5 $ pm $ 12.5 ps。在6–18 GHz上,对于所有16个相位状态,八个通道之间的RMS相位失配和RMS增益失配分别为≪2.7 ^和0.4 dB。由8个元素组成的阵列可以在任何中心频率下即时运行,并具有一个宽带宽(3至6 GHz,取决于中心频率),该带宽主要由6-18 GHz范围内的3 dB增益变化决定。据我们所知,这是硅芯片上全RF相控阵列的首次演示,该芯片具有非常低的RMS相位和6–18 GHz的增益误差。芯片尺寸为$ 2.2×2.45 {hbox {mm}} ^ {2} $,包括所有焊盘。

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