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A Differential Data-Aware Power-Supplied (D$^{2}$AP) 8T SRAM Cell With Expanded Write/Read Stabilities for Lower VDDmin Applications

机译:具有扩展的写入/读取稳定性的差分数据感知功率上电(D $ ^ {2} $ AP)8T SRAM单元,适用于更低的VDDmin应用

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摘要

Due to global and local process variations, on-chip SRAM suffers failures at a low supply voltage (VDD). This study proposes a differential data-aware power-supplied D$^{2}$ AP 8T SRAM cell to address the stability and trade-off-issues between write and half-select accesses that still remain in the conventional 8T and 6T cells. Powered by its bitline pair, the proposed 8T cell applies differential data-aware-supplied voltages to its cross-coupled inverters to increase both stability margins for write and half-select accesses. A boosted bitline scheme also improves the read cell current. Two 39 Kb SRAM macros, D $^{2}$AP-8T and conventional 8T, with the same peripheral circuits were fabricated on the same testchip with 45 nm and 40 nm processes. The measured VDDmin for the D $^{2}$AP-8T macro is 240 mV–200 mV lower than that of the conventional 8T macro across lots, wafers and dies.
机译:由于全局和局部过程的变化,片上SRAM在低电源电压(VDD)下会发生故障。这项研究提出了一种差分数据感知的电源供电的D $ ^ {2} $ AP 8T SRAM单元,以解决传统8T和6T单元中仍然存在的写访问和半选择访问之间的稳定性和折衷问题。拟议的8T单元由其位线对供电,向其交叉耦合的反相器施加差分数据感知电压,以提高写入和半选择访问的稳定性裕度。增强的位线方案还改善了读取单元电流。两个具有相同外围电路的39 Kb SRAM宏D $ ^ {2} $ AP-8T和常规8T在同一测试芯片上以45 nm和40 nm工艺制造。对于D $ ^ {2} $ AP-8T宏,在批次,晶圆和管芯上,测量的VDDmin较常规8T宏的VDDmin低240 mV–200 mV。

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