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首页> 外文期刊>Semiconductor science and technology >Analysis of buffer-impurity and field-plate effects on breakdown characteristics in small-sized AlGaN/GaN high electron mobility transistors
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Analysis of buffer-impurity and field-plate effects on breakdown characteristics in small-sized AlGaN/GaN high electron mobility transistors

机译:缓冲杂质和场板对小型AlGaN / GaN高电子迁移率晶体管击穿特性的影响分析

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摘要

The two-dimensional analysis of breakdown characteristics in field-plate AlGaN/GaN high electron mobility transistors with a relatively short gate length and short gate-to-drain distances is performed by considering a deep donor and a deep acceptor in a buffer layer. It is shown that when the acceptor density in the buffer layer is high, the breakdown voltage is determined by the impact ionization of carriers, and it can decrease with increasing the field-plate length. This is because the distance between the field-plate edge and the drain becomes very short and the electric field there becomes very high. On the other hand, when the acceptor density in the buffer layer is relatively low, the buffer leakage current becomes very large and this can determine the breakdown voltage, which becomes very low. In this case, the breakdown voltage increases with increasing the field-plate length.
机译:通过考虑缓冲层中的深施主和深受主,对具有相对较短的栅极长度和较短的栅极至漏极距离的场板AlGaN / GaN高电子迁移率晶体管的击穿特性进行了二维分析。结果表明,当缓冲层中的受体密度高时,击穿电压取决于载流子的碰撞电离,并且随着场板长度的增加,击穿电压会降低。这是因为场板边缘和漏极之间的距离变得非常短,并且那里的电场变得非常高。另一方面,当缓冲层中的受主密度相对较低时,缓冲泄漏电流变得非常大,并且这可以确定击穿电压,该击穿电压变得非常低。在这种情况下,击穿电压随着场板长度的增加而增加。

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  • 来源
    《Semiconductor science and technology》 |2012年第8期|p.085016.1-085016.6|共6页
  • 作者单位

    Faculty of Systems Engineering, Shibaura Institute of Technology, 307 Fukasaku, Minuma-ku,Sitama 337-8570, Japan;

    Faculty of Systems Engineering, Shibaura Institute of Technology, 307 Fukasaku, Minuma-ku,Sitama 337-8570, Japan;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
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