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A modified analytical model for AlGaN/GaN FinFETs /- V characteristics

机译:AlGaN / GaN FinFET的改进分析模型-V特性

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In this paper, a high electron mobility transistor's (HEMT) analytical model, which is based on the vertical operation of Schottky barrier gate, has been modified for the I-V characteristics of rectangular shaped AlGaN/GaN FinFETs having three-sided Schottky barrier gate operation. The proposed model includes the effect of the tri-gate structure on sheet carrier concentration (n(s)) of the device. A three dimensional Poisson equation is solved keeping in view, the device geometry and applied potentials, to get the effect of the side gates on n(s). It is demonstrated that n(s) of a FinFET depletes relatively faster than its HEMT counterpart due to the extra fields caused by the side gates. Knowing bias dependent n(s), FinFET I-V expressions are developed and tested on AlGaN/GaN FinFETs of varying gate lengths (L-g = 0.4 - 1.0 mu m) for the above threshold regime. A good agreement between the experimental and modeled characteristics is observed, which demonstrates the validity of the proposed model in predicting the DC characteristics of tri-gate AlGaN/GaN FinFETs.
机译:本文针对肖特基势垒栅的垂直操作对高电子迁移率晶体管(HEMT)的分析模型进行了修改,以实现具有三面肖特基势垒栅操作的矩形AlGaN / GaN FinFET的I-V特性。提出的模型包括三栅极结构对器件的薄层载流子浓度(n(s))的影响。在考虑器件几何形状和施加电势的情况下,求解了一个三维泊松方程,以获得侧门对n(s)的影响。已经证明,由于侧栅极引起的额外场,FinFET的n(s)损耗比其HEMT相对快。知道与偏置有关的n(s),对于上述阈值方案,在不同栅极长度(L-g = 0.4-1.0μm)的AlGaN / GaN FinFET上开发并测试了FinFET I-V表达式。观察到实验和建模特性之间的良好一致性,这证明了所提出的模型在预测三栅AlGaN / GaN FinFET的直流特性方面的有效性。

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