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Impact of Si precursor mixing on the low temperature growth kinetics of Si and SiGe

机译:Si前驱体混合对Si和SiGe低温生长动力学的影响

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I have quantified, in a 300 mm ASM Epsilon 3200 tool, the impact of adding SiH4 or SiH2Cl2 to Si2H6 on the low temperature growth kinetics of Si and SiGe. Increasing the amount of Si atoms by adding the formers to the latter resulted in Si growth rates (GR) reductions (i) at 20 Torr, in the 500 degrees C-575 degrees C range and (ii) at 525 degrees C, in the 20-90 Torr range. Those GR decreases were more pronounced with SiH2Cl2 than with SiH4. I have otherwise investigated the 525 degrees C, 20 Torr growth kinetics of SiGe with germane (GeH4) as the Ge source and various mixes of Si precursors. The GR associated with a SiH2Cl2 + GeH4 chemistry was lower than the Si2H6 + SiH2Cl2 + GeH4 GR, which was itself lower than the Si2H6 + GeH4 one. Meanwhile, the Ge content was much higher with SiH2Cl2 + GeH4 than with Si2H6 + SiH2Cl2 + GeH4. The later was itself similar to 1% to similar to 4% higher than the Si2H6 + GeH4 one depending on the GeH4 flow. As for pure Si, Si2H6 governed the SiGe growth kinetics, with SiH2Cl2 acting as if it was a source of HCl (GR reduction and slight Ge content increase). The situation was more complex when adding SiH4 to Si2H6 + GeH4. The Si2H6 + SiH4 + GeH4 GR was always lower than the Si2H6 + GeH4 one. Meanwhile, the SiH4 + GeH4 GR was either lower or higher than the other two depending on the GeH4 flow. The Ge content was significantly higher with SiH4 + GeH4 than with Si2H6 + SiH4 + GeH4 (27%-53% range double left right arrow 9%-32% range). The latter was itself similar to 2% lower than the Si2H6 + GeH4 one. As before, Si2H6 governed the SiGe growth kinetics, with SiH4 slightly reducing both the GR and the Ge content, which is unusual. Plotting the SiGe GR as functions of the Ge concentration showed that the addition of SiH4 or SiH2Cl2 molecules did not dramatically change the SiGe growth kinetics, which was predominantly governed at 525 degrees C, 20 Torr by Si2H6.
机译:我已经在300 mm ASM Epsilon 3200工具中量化了向Si2H6中添加SiH4或SiH2Cl2对Si和SiGe低温生长动力学的影响。通过将前者添加到后者中来增加Si原子的数量,导致(i)在500摄氏度至575摄氏度范围内20 Torr下和(ii)在525摄氏度范围内Si生长速率(GR)降低。 20-90托范围。与使用SiH4相比,使用SiH2Cl2显着降低了GR。除此以外,我还研究了以锗烷(GeH4)为锗源和各种硅前驱体混合物的525摄氏度,20托增长的SiGe生长动力学。与SiH2Cl2 + GeH4化学性质相关的GR低于Si2H6 + SiH2Cl2 + GeH4 GR,后者本身低于Si2H6 + GeH4之一。同时,SiH2Cl2 + GeH4的Ge含量比Si2H6 + SiH2Cl2 + GeH4的Ge含量高得多。后者本身比Si2H6 + GeH4高出1%至4%,这取决于GeH4流量。至于纯Si,Si2H6决定了SiGe的生长动力学,而SiH2Cl2就像是HCl的来源一样(GR降低,Ge含量略有增加)。将SiH4添加到Si2H6 + GeH4中时,情况更加复杂。 Si2H6 + SiH4 + GeH4 GR始终低于Si2H6 + GeH4 GR。同时,取决于GeH4的流量,SiH4 + GeH4 GR低于或高于其他两个。 SiH4 + GeH4的Ge含量显着高于Si2H6 + SiH4 + GeH4的Ge含量(27%-53%范围,双左向右箭头9%-32%范围)。后者本身比Si2H6 + GeH4低2%。和以前一样,Si2H6决定了SiGe的生长动力学,而SiH4则稍微降低了GR和Ge含量,这是不寻常的。将SiGe GR绘制为Ge浓度的函数表明,添加SiH4或SiH2Cl2分子不会显着改变SiGe的生长动力学,而SiGeH的生长动力学主要在525摄氏度,20托条件下发生。

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