Creating Stable and Flexible Chips for Thin Packages

摘要

Wafer thinning has become a key technology for the semiconductor industry during recent years. It has fa-cilitated such tech-nologies as smart cards and RFID devices, and is becoming a significant enabler for the stacked-die packages that are increasingly prevalent in the latest cell phones, PDAs and other smaller, lighter, more powerful electronic devices. As wafers are thinned to <100 μm, manufacturers must incorporate new methods of thinning beyond mechanical backgrinding, and they must be more concerned about such parameters as the wafer's breaking strength, flexibility, roughness and dicing quality. This article will detail findings of the mechanical properties of wafers after thinning, and discuss which parameters are the most important for viable thin packages.