System-in-Package Uses Silicon Substrate

摘要

For as long as flip-chip technology has been around, silicon has been examined as a package substrate material, in part to avoid coefficient of thermal expansion (CTE) mismatch problems. In recent years, silicon package substrates have been used to increase interconnection density for system-in-package (SiP) applications. STATS (Singapore) recently announced the availability of its chip-scale module package (CSMP) for the integration of passives and ICs in an SiP module, using silicon as a substrate.