毫米波系统级封装中的基板功能化实现

摘要

The concept, function and realization of substrate functionalization in millimeter -wave( MMW) system on package ( SOP ) are presented in this paper. By using Low Temperature Co-fired Ceramic ( LTCC) technology, multiple MMW passive circuit cells are incorporated into multi-layer ceramic sub-strate to make the substrate which is taken as the carrier of surface-mounted active chips have correspond-ing passive RF function by itself. Finally,comparison among simulation and measurement proves the feasi-bility of functional substrate, and good performance related to RF filtering, multilayer signal interconnec-tion and RF connection-port transition.%阐述了毫米波系统级封装( SOP)架构中基板功能化的概念、作用及实现方法。提出了利用低温共烧陶瓷( LTCC)技术，在SOP多层陶瓷基板中一体化集成多种无源电路单元，使封装基板在作为表面贴装有源芯片载体的同时，自身具备相应的无源射频功能。最终通过设计实例的仿真、加工及测试对比，验证了在SOP架构下实现封装基板功能化的可行性，及其所具有的良好的射频滤波、层间信号互联、射频接口过渡等电气性能。