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Inside the Physics of Dielectric Films

机译:介电膜的物理原理

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We characterized the dielectric properties of thin-film materials using a capacitive stack approach. Dielectric constant and loss tangent measurements were taken using a stacked MIS topology for single bias and frequency as well as a frequency sweep analysis. Multiple dielectric films were also measured and compared with theoretical predictions. Measurement of dielectric constant vs. frequency followed the generalized model of inverse proportionality to frequency. For dual insulator dielectrics, the measured dielectric constant closely matched the modeled value.
机译:我们使用电容性堆叠方法表征了薄膜材料的介电性能。介电常数和损耗角正切的测量是使用堆叠式MIS拓扑结构进行的,用于单个偏置和频率以及频率扫描分析。还测量了多个介电膜,并将其与理论预测值进行了比较。介电常数与频率的关系遵循与频率成反比的通用模型。对于双绝缘体电介质,测得的介电常数与模型值非常匹配。

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