Packaging for Multi-Stack Die Applications

摘要

The market demand for smaller, lighter and more powerful cell phones, PDAs and other electronic devices is driving the development of more compact electronic packages with increased functionality. Total production of stacked die packages in 2002 was 150 million units. At least 95% of this production was driven by mobile phones and wireless PDAs, incorporating stacked flash and SRAM. Cell phones, in which size and modularity are major factors, are a perfect application for stacked die. Major manufacturers of cell phones are using stacked chip-scale packages (CSPs) for flash and SRAM devices in their leading-edge phones. In Japan, cell phone manufacturers employ stacked technology in virtually all of their products. This trend is expected to continue, with the compound annual growth rate in this market segment growing 50-60% through 2006. Prismark's forecast of the worldwide mobile phone market is estimated at 15-24% for that period. For reference, there were 393 million cell phones sold during 2001. Analysts target cell phone consumption at between 785 million and 1.14 trillion in 2006. In addition to replacement sales in developed countries, cell phone growth will largely increase in developing countries, particularly in Asia.