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GlobalFoundries Integrates Chartered

机译:GlobalFoundries整合特许

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GlobalFoundries officially brought Chartered Semiconductor into its fold, moving the GlobalFoundries operations headquarters to a former Chartered building in Milpitas, Calif., and beginning a head-to-head foundry competition with TSMC. About 100 GlobalFoundries workers moved from Sunnyvale, Calif., into the new headquarters.rnWith CEO Doug Grose, who earlier worked at IBM, remaining at the helm, former Chartered CEO Chia Songhwee is now the COO of GlobalFoundries. The 300 mm fab in upstate New York, expected to begin production in 2012, is now referred to as Fab 8, and the two fab modules in eastern Germany are called Fab 1. Those 300 mm fabs complement the 300 mm fab in Singapore, Fab 7, along with five 200 mm fabs in Singapore. By 2014, GlobalFoundries said it expects to have annual capacity for 1.6 million 300 mm wafers, and 2.2 million 200 mm wafers, for a total of 5.8 million 200 mm equivalents.
机译:GlobalFoundries正式将Chartered Semiconductor纳入考虑范围,将GlobalFoundries运营总部迁至加利福尼亚州米尔皮塔斯市以前的Chartered建筑,并开始与台积电进行全面的铸造竞争。大约100名GlobalFoundries工人从加利福尼亚州森尼韦尔搬到了新总部。rn之前在IBM工作过的CEO Doug Grose仍在掌舵之下,前特许首席执行官Chia Songhwee现在是GlobalFoundries的首席运营官。纽约州北部的300毫米晶圆厂预计将于2012年开始生产,现在称为Fab 8,而德国东部的两个晶圆厂模块称为Fab1。这300毫米晶圆厂是新加坡300毫米晶圆厂的补充7,以及新加坡的五个200毫米晶圆厂。 GlobalFoundries表示,到2014年,它预计将具有160万枚300 mm晶圆和220万枚200 mm晶圆的年产能,总计580万枚200 mm晶圆。

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