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Epitaxial Growth Mechanism of a Bonding Layer and an α-Al_2O_3 Layer on a Ti(C,N)Layer

机译:Ti(C,N)层上键合层和α-Al_2O_3层的外延生长机理

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摘要

Microstructure of a newly developed "long-tool-life"α-Al_2O_3 coated cutting tool and mechanism of epitaxial growth of the α-Al_2O_3 layer has been investigated. The tool was produced by coating cemented carbide chips with layers of a TiN layer, a Ti(C, N) layer, a bonding layer and anα-Al_2O_3 layer successively and in this order using the techniques of CVD. Cross section TEM Analysis revealed the existence of a column in whichα-Al_2O_3 grains had grown epitaxially around a protrusion formed around a {111} twin plane in the bonding layer twin which had in turn had grown in a similar way (epitaxially) on a surface of a Ti(C,N) twin, and also the surface of the protrusion is civered with steps on the atomic scale.
机译:研究了新开发的“长寿命”α-Al_2O_3涂层切削刀具的微观结构以及外延生长α-Al_2O_3层的机理。通过用CVD技术依次并依次涂覆TiN层,Ti(C,N)层,结合层和α-Al_2O_3层的层来制造硬质合金片,从而制造该工具。横截面TEM分析显示存在这样的柱,其中α-Al_2O_3晶粒在接合层孪晶中的{111}孪晶面周围形成的突起周围外延生长,该接合层又以类似方式(外延)在表面上生长Ti(C,N)孪晶的横截面,并且突起的表面也按原子级的台阶分布。

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