Stacked Flex Circuits

摘要

Chip-scale or chip-size packaging is currently in wide use throughout the electronics industry, often providing opportunities to dramatically reduce the product size-to-function ratio. Some companies attempting to achieve even more functionality in a small space and improve a product's performance have considered the system-on-a-chip (SoC) concept, which combines several electronic functions within a single die. But because of the differing complexities of fabrication between memory and processors, the overall yield for SoC fabrication has not proven satisfactory. Mounting several die types on a common substrate or system-in-package (SiP), on the other hand, can provide a higher process yield and dramatically improve time-to-market.