Flip-Chip vs. Wirebond

摘要

Tougher competition in existing wireless communication markets and emerging wireless applications that utilize a higher frequency spectrum are pushing hardware vendors to make more competitive products (such as the front-ends and the passive and active components). In the last few years, the need for high integration levels for RF and microwave applications have made the choice of interconnection solutions a very important issue, especially since the quality of these interconnects has a major impact on the performance and cost of the entire system. The need for better electrical performance―along with the cost reduction necessary for achieving the large growing potential of the wireless market―make vertical interconnections very promising. In recent years, both level-1 (chip-to-package) and level-2 (package-to-board) vertical interconnects have been considered. This article will summarize the advantages and the drawbacks of flip-chip vs. the widely used wirebond for microwave and millimeter-wave (mm-wave) applications, and how these affect the job of designers and engineers. As an alternative solution, ball grid array (BGA) packaging also will be addressed.