New Technique for Wirebonding Using Indium Spheres

摘要

A new technique has been developed for wirebonding mercury cadmium telluride (MCT) devices using indium spheres. Indium powder with a mesh size of 170/200 is made up of indium spheres. These spheres are used as solder between the gold pad on the MCT device and the gold ball of the wirebond. This novel technique eliminates damage that typically occurs to the MCT material under gold wirebonding pads due to force and ultrasonic power needed in wirebonding.