The microelectronic assembly 10 can include a substrate 30 having first and second surfaces 34 and 58, an opening 39 extending therebetween, and a terminal 36. [ The assembly 10 includes a first microelectronic component 12 having a front side 16 opposite the first side 34 and a second microelectronic component 12 having a front side 22 protruding beyond the edge 29 of the first microelectronic component. 2 microelectronic device 14, first and second leads 70, 76 for electrically connecting the contacts 20, 52 of the microelectronic device to the terminals, and contacts of the first and second microelectronic devices, And may further include a third lead 73 electrically interconnected. The contact 20 of the first microelectronic device 12 may be disposed adjacent the edge 29. The contact 26 of the second microelectronic device 14 may be disposed in a central region 19 of its front side 22. The leads 70, 76, 99 may have portions aligned with the openings 39.
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