3D Multi-board Product-Level PCB and IC Packaging Design

摘要

In pursuit of feature-rich, light, compact products at a lower cost in less time, designers are increasingly creating complex multi-board products and using new packaging technologies to pack integrated circuits more closely together. Multi-board designs create new challenges such as planning and management of interconnects at the system level. The greater complexity of new packaging technologies means components need to be more tightly coordinated with one another so that pin assignments can be optimized for small size and minimum layer count substrates. Traditional 2D printed circuit board design systems are not well-suited to address these challenges because they are used to design one PCB at a time in isolation from the other PCBs within a product and also in isolation from the ICs, packages and enclosure.