...
首页> 外文期刊>Physica status solidi >Study of the Temperature Dependence of AlGaN/GaN HEMTs with Oxygen Plasma Treatment
【24h】

Study of the Temperature Dependence of AlGaN/GaN HEMTs with Oxygen Plasma Treatment

机译:氧等离子体处理AlGaN / GaN HEMTs的温度依赖性研究

获取原文
获取原文并翻译 | 示例
   

获取外文期刊封面封底 >>

       

摘要

The temperature-dependent characteristics of AlGaN/GaN high electronrnmobility transistors (HEMTs) and recessed-gate AlGaN/GaN HEMTs combinedrnwith oxygen plasma treatment (rec+oxy HEMTs) are investigated overrna range from 25 to 300 ℃. The peak transconductance and saturation currentrnof both types of devices decrease with the increase of temperature due to therndecline of channel electron mobility. It is interesting to find that the thresholdrnvoltage (VTH) exhibits a positive shift in the conventional HEMT, while arnnegative shift in the rec+oxy HEMT with temperature increases. Thernincrease in gate leakage current with the temperature is dominated byrntunneling mechanism. Furthermore, the annealing process of 300 and 400 ℃rnfor 2 min in N2 ambient are utilized in these two kinds of devices for furtherrnestimation, respectively. It is found that the channel mobility can bernrecovered after the 400℃ annealing process, but the VTH shows an obviousrnnegative shift in recþoxy HEMTs.
机译:在25〜300℃范围内研究了AlGaN / GaN高电子迁移率晶体管(HEMTs)和结合氧等离子体处理(rec + oxy HEMTs)的凹栅AlGaN / GaN HEMT的温度依赖性。由于沟道电子迁移率的下降,两种类型的器件的峰值跨导和饱和电流均随着温度的升高而降低。有趣的是,阈值电压(VTH)在常规HEMT中表现出正向偏移,而随着温度的升高,rec + oxy HEMT中的负向偏移。栅极漏电流随温度的升高主要受隧穿机制的影响。此外,在这两种设备中分别在N2环境中分别在300和400℃的退火温度下进行2分钟的退火处理。结果表明,在400℃退火后,通道迁移率可以恢复,但VTH在反式HEMT中表现出明显的负向偏移。

著录项

  • 来源
    《Physica status solidi》 |2018年第14期|1800092.1-1800092.5|共5页
  • 作者单位

    Key Lab of Wide Band gap Semiconductor Materials and Devices The School of Microelectronics, Xidian University Xi‘an 710071, China;

    Key Lab of Wide Band gap Semiconductor Materials and Devices The School of Microelectronics, Xidian University Xi‘an 710071, China;

    Key Lab of Wide Band gap Semiconductor Materials and Devices The School of Microelectronics, Xidian University Xi‘an 710071, China;

    Key Lab of Wide Band gap Semiconductor Materials and Devices The School of Microelectronics, Xidian University Xi‘an 710071, China;

    Key Lab of Wide Band gap Semiconductor Materials and Devices The School of Microelectronics, Xidian University Xi‘an 710071, China;

    Key Lab of Wide Band gap Semiconductor Materials and Devices The School of Microelectronics, Xidian University Xi‘an 710071, China;

    Key Lab of Wide Band gap Semiconductor Materials and Devices The School of Microelectronics, Xidian University Xi‘an 710071, China;

    Key Lab of Wide Band gap Semiconductor Materials and Devices The School of Microelectronics, Xidian University Xi‘an 710071, China;

    Key Lab of Wide Band gap Semiconductor Materials and Devices The School of Microelectronics, Xidian University Xi‘an 710071, China;

    Key Lab of Wide Band gap Semiconductor Materials and Devices The School of Microelectronics, Xidian University Xi‘an 710071, China;

    Key Lab of Wide Band gap Semiconductor Materials and Devices The School of Microelectronics, Xidian University Xi‘an 710071, China;

  • 收录信息
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号