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Silicon nitride passivation with ammonia plasma pretreatment for improving reliability of AlGaN/GaN HEMTs

机译:氨等离子体预处理的氮化硅钝化可提高AlGaN / GaN HEMT的可靠性

摘要

This invention pertains to an electronic device and to a method for making it. The device is a heterojunction transistor, particularly a high electron mobility transistor, characterized by presence of a 2 DEG channel. Transistors of this invention contain an AlGaN barrier and a GaN buffer, with the channel disposed, when present, at the interface of the barrier and the buffer. Surface treated with ammonia plasma resembles untreated surface. The method pertains to treatment of the device with ammonia plasma prior to passivation to extend reliability of the device beyond a period of time on the order of 300 hours of operation, the device typically being a 2 DEG AlGaN/GaN high electron mobility transistor with essentially no gate lag and with essentially no rf power output degradation.
机译:电子设备及其制造方法技术领域本发明涉及一种电子设备及其制造方法。该器件是异质结晶体管,特别是高电子迁移率晶体管,其特征在于存在2°沟道。本发明的晶体管包含AlGaN势垒和GaN缓冲剂,当存在沟道时,将沟道设置在势垒和缓冲剂的界面处。用氨等离子体处理过的表面类似于未处理过的表面。该方法涉及在钝化之前用氨等离子体处理器件,以将器件的可靠性扩展到超过大约300小时的运行时间,该器件通常是2 DEG AlGaN / GaN高电子迁移率晶体管,基本上具有没有门延迟,并且基本上没有射频功率输出下降。

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