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Solution growth of AlN single crystal using Cu solvent under atmospheric pressure nitrogen

机译:常压氮气下使用Cu溶剂固溶生长AlN单晶

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We have grown thick AlN epilayers on SiC substrates by a new solution growth technique using Cu solvents under atmospheric pressure nitrogen. By using growth apparatus based on CZ growth system with inductive heating, we have grown AlN single crystalline layers of which thickness were more than 200 μm on (4H,6H)-SiC substrates at relatively low growth temperatures such as 1600℃-1800℃. Inch-size self standing AlN crystals were also prepared by removing the SiC substrate. TEM observation, ω-scan XRD measurement and cathode luminescence spectroscopy were conducted to characterize the crystallin-ity of the obtained AM layers.
机译:我们已经通过一种新的溶液生长技术在常压氮气下使用Cu溶剂在SiC衬底上生长了厚厚的AlN外延层。通过使用基于CZ生长系统的感应加热生长设备,我们在(4H,6H)-SiC衬底上以相对较低的生长温度(例如1600℃-1800℃)生长了厚度大于200μm的AlN单晶层。还通过去除SiC衬底制备了英寸尺寸的自立式AlN晶体。进行TEM观察,ω-扫描XRD测量和阴极发光光谱法以表征所获得的AM层的结晶度。

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