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首页> 外文期刊>Physica Status Solidi. C, Conferences and critical reviews >Inductively coupled plasma etching of GaN using SiCl_4/Cl_2/Ar for submicron-sized features fabrication
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Inductively coupled plasma etching of GaN using SiCl_4/Cl_2/Ar for submicron-sized features fabrication

机译:使用SiCl_4 / Cl_2 / Ar进行GaN的电感耦合等离子体刻蚀,用于亚微米级特征的制造

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摘要

In this paper we report the optimization of the fabrication process of a grating coupler, which is fully integrated with a GaN planar waveguide. To our knowledge, this is the first report of a grating-assisted optical coupler in gallium nitride. ICP dry etching of n-doped GaN layers was investigated, where SiCl_4/Cl_2/Ar gas mixture was used under different etching conditions. We report n-GaN ICP etching ratio of 520-2680 A min~(-1) as well as etching selectivity of GaN over SiO_2 from 3 to 8, in the most cases. Grating ridge and grating groove width as well as the sidewalls slope were evaluated by SEM microscope.
机译:在本文中,我们报告了与GaN平面波导完全集成的光栅耦合器制造工艺的优化。据我们所知,这是氮化镓中光栅辅助光耦合器的首次报道。研究了n掺杂GaN层的ICP干法刻蚀,其中在不同刻蚀条件下使用SiCl_4 / Cl_2 / Ar气体混合物。在大多数情况下,我们报告的n-GaN ICP蚀刻比为520-2680 A min〜(-1),以及GaN对SiO_2的蚀刻选择性为3至8。用SEM显微镜评估光栅的脊和光栅槽的宽度以及侧壁的斜率。

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