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Shuffle-set dislocation nucleation in semiconductor silicon device

机译:半导体硅器件中的混洗位错成核

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We have found that a shuffle-set dislocation is nucleated in a semiconductor silicon device subjected to severe thermal processing. The dislocation transforms into a dissociated glide-set dislocation after annealing at 500°C. A possible mechanism for the nucleation of a perfect shuffle-set dislocation during thermal processing is that the dislocation nucleus was nucleated at a low temperature during prior ion-implantation processing.View full textDownload full textKeywordsdislocation, semiconductors, silicon, shuffle-glideRelated var addthis_config = { ui_cobrand: "Taylor & Francis Online", services_compact: "citeulike,netvibes,twitter,technorati,delicious,linkedin,facebook,stumbleupon,digg,google,more", pubid: "ra-4dff56cd6bb1830b" }; Add to shortlist Link Permalink http://dx.doi.org/10.1080/09500839.2010.501767
机译:我们已经发现,在经历严格热处理的半导体硅器件中,混晶位错成核。在500°C退火后,位错转换成解离的滑移集位错。热处理过程中完美的shuffle-set位错成核的可能机制是,在先前的离子注入过程中,位错核是在低温下成核的。查看全文下载全文关键字dislocation,半导体,硅,shuffle-glide相关的var addthis_config = {ui_cobrand:“ Taylor&Francis Online”,servicescompact:“ citeulike,netvibes,twitter,technorati,delicious,linkedin,facebook,stumbleupon,digg,google,更多”,发布:“ ra-4dff56cd6bb1830b”};添加到候选列表链接永久链接http://dx.doi.org/10.1080/09500839.2010.501767

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