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Exploiting lateral current flow due to doped layers in semiconductor devices having crossbar electrodes

机译:利用具有交叉电极的半导体器件中的掺杂层来开发横向电流

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Organic electronic devices such as light-emitting diodes, solar cells or rectifying diodes normally have a sandwich layer architecture stacked between the electrodes in a crossbar layout. Often however, the side effects of operating the devices in such an arrangement are either ignored or give rise to misinterpretations regarding the device performance or layer quality. For the sake of simplicity, device currents are typically assumed to exclusively flow in the direction vertical to the substrate, even though the conductivity of doped organic layers is high and gives rise to significant lateral current flows. Here, we study the vertical and lateral charge up along the n-doped and the p-doped layers as well as the resulting capacitance increase of charging the intrinsic layer outside the active area. We observe that controlling such lateral charging by structuring the doped layers can reduce the leakage current dramatically. We employ impedance spectroscopy to investigate the lateral charging responsibility for the capacitance increase at low frequencies. Modeling of the devices by a distributed RC circuit model yields information about the thickness, the conductivity, and the corresponding activation energy of both, the n-doped and the p-doped layers, simultaneously. We demonstrate that the capacitive effects from lateral charging can easily be misinterpreted as trap states in capacitance frequency characteristics. However, correct analysis with the proposed model actually yields rich and detailed post-fabrication information which can be utilized in device failure and degradation tests. Moreover, our results will aid the design and characterization of new electronic devices where lateral charge flow is part of the device concept.
机译:诸如发光二极管,太阳能电池或整流二极管之类的有机电子设备通常具有以交叉开关布局堆叠在电极之间的夹层结构。然而,通常以这种布置操作设备的副作用要么被忽略,要么引起对设备性能或层质量的误解。为了简单起见,即使掺杂的有机层的电导率很高并且引起明显的横向电流流动,通常也假定器件电流仅在垂直于衬底的方向上流动。在这里,我们研究了沿n掺杂层和p掺杂层的垂直和横向电荷,以及在有源区之外对本征层进行充电所导致的电容增加。我们观察到通过构造掺杂层来控制这种横向电荷可以显着降低泄漏电流。我们采用阻抗光谱技术来研究横向充电对低频电容增加的影响。通过分布式RC电路模型对器件进行建模可同时获得有关n掺杂层和p掺杂层的厚度,电导率以及相应的激活能的信息。我们证明,横向充电的电容效应很容易被误解为电容频率特性中的陷阱状态。但是,使用建议的模型进行正确的分析实际上会产生丰富而详细的制造后信息,这些信息可用于设备故障和性能下降测试。而且,我们的结果将有助于设计和表征新型电子设备,其中横向电荷流是设备概念的一部分。

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